Kiwimoore provides a world-leading dielets product solution with Chiplet architecture, interconnect dielets, dedicated design tools, and a vast library of 3rd-party dielets. Customers only need to develop core dies, and reuse others for design and combine, build high-performance chips, maximize R&D costs and shorten design cycles. Meanwhile, based on ultra-high-speed interconnection chiplet, enhance ultra-scaling system level, enabling Moore's Law's next frontier through heterogeneous integration.
·Compatible with high-performance Chiplets for data center CPU/GPU/AI and autonomous vehicles. ·Great Improves chip performance and reduces R&D cost and cycle·High-performance 3DIC Base Die, integrated High-Speed interconnect, IO Hub, 3D near-memory, high current power supply, etc. ·Integrated high-speed interfaces (PCIe, DDR/HBM, etc.) ·High-speed interconnect via “Kiwi Fabric-3D”, an internetwork on Chiplet. ·Compatible with 3D chiplet architecture and broadly support Advanced 3DIC Packaging Solutions.
·Compatible with high-performance Chiplets for data center CPU/GPU/AI and autonomous vehicles. ·Great Improves chip performance and reduces R&D cost and cycle. ·High-Performance Interconnect Hub, multi-Die Chiplet interconnect, integrating high-speed interfaces including Die2Die, PCIe, DDR, etc. ·High-speed interconnect via “Kiwi Fabric-3D”, an internetwork on Chiplet. Chiplet Network “Kiwi Fabric” ·Compatible with 3D chiplet architecture and broadly support Advanced 3DIC Packaging Solutions (Substrate, RDL/SI Interposer).
Kiwi Link UCIe Die2Die接口IP
·全面支持UCIe标准 ·业界优异综合性能，高带宽、低功耗、低延时 ·前面全面支持多种封装形态
Die-to-Die Interface IP
·Chiplet-Specific Die2Die IP with Low Latency. ·UCIe Standards Supported. ·Controller, PHY, Verification IP Included. ·Industry-leading integrated performance: High Bandwidth, Low Power & Latency. ·Full Support 2.xD/2.5D/3D Packaging, incl. Substrate, RDL/SI Interposer, 3DIC.
·Automatic Base & IO Die Design tools. ·Auto-Routing, 3D-Stacking, Base die Configuration & More functions. ·Integration with EDA tools, rapidly complete design, verification, simulation, etc.
·Compatible with high-performance Chiplets for data center CPU/GPU/AI and autonomous vehicles. ·Great Improves chip performance and reduces R&D cost and cycle·High-performance 3DIC Base Die, integrated High-Speed interconnect, IO Hub, 3D near-memory, high current power supply, etc. ·Integrated high-speed interfaces (PCIe, DDR/HBM, etc.) ·High-speed interconnect via “Kiwi Fabric-3D”, an internetwork on Chiplet. ·Compatible with 3D chiplet architecture and broadly support Advanced 3DIC Packaging Solutions.
